Your partner for soldering solutions NIHON SUPERIOR

A lead-free solder with established
various track records and reliability

About SN100C

SN100C is a lead-free solder alloy developed by NIHON SUPERIOR.
The composition of the alloy is Sn (tin)-Cu (copper)-Ni (nickel)-Ge (germanium).
It does not contain silver, which greatly contributes to lower cost of materials.
The basic composition of the alloy, Sn-Cu-Ni, is registered in the international standard ISO.

Alloy Properties

From the refinement of the intermetalic compound from the microaddition of Ni and the antioxidation effect of Ge, the features of SN100C are :

Problems faced by conventional lead-free solders (e.g. Sn-3.0Ag-0.5Cu)

SN100C can solve the problems

Icicles and bridges

Immediately after withdrawal

After solidification

Bridging

Excellent Fluidity

Immediately after withdrawal

After solidification

No bridging

Ni + Ge delivers high fluidity ensuring minimal shorts and icicles.
Insufficient Wetting

Defective fillet

Excellent wettability

Excellent fillet

Excellent wetting shortens total wetting time and forms excellent fillets.
Shirinkage and cracks

Whole Surface

Magnified Cross-Section

Less shrinkage

Whole Surface

Magnified Cross-Section

The Ni effect inhibits the shrinkage and forms smooth fillets.
Copper erosion

Through hole (erodes copper)

Reduced copper erosion

Through hole (no copper erosion)

Erodes copper more slowly with its Ni barier effect.
IMC growth

Part of the IMC grew

Stable IMC

The grain size of the IMC is uniform

SN100C forms a stable intermetallic compound layer at the solder copper interface.

Adoption Results

The cumulative number of products using SN100C for joining electronic components has reached more than 2.4 billion units. This extensive track record is proof of SN100C's reliability.