Presented Paper
2020
Title
Presented at
Data
Nihon Superior SN100CV Reliability in Simplicity
Global SMT & PACKAGING（2020年3月号）
Trafalgar Publications Limited.
Trafalgar Publications Limited.
2019
Title
Presented at
Data
Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages
SMT007 MAGAZINE（2019年7月号）
BR Publishing, Inc.
BR Publishing, Inc.
2012
Title
Presented at
Data
Pushing the Limits of Lead-Free Soldering
Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
View research paper data
PDF data size:50KB
The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints
Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
View research paper data
PDF data size:45KB
Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation
Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
View research paper data
PDF data size:46KB
2011
Title
Presented at
Data
The Investigation of an Improved Tin-Zinc Solder for Practical Use
International Conference on Electronics Packaging (ICEP) 2011
View research paper data
PDF data size:28KB