Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #1904 at the IPC APEX EXPO 2017, scheduled to take place March 14-16, 2017 at the San Diego Convention Center.

 

The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

 

During the show, the company will showcase newly developed products that offer solutions for some of the challenges the electronics industry is now facing, such as improvements in reliability, thermally stable joining, and lead-free die attach.