Nihon Superior Co. Ltd will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 – Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL.

 

During the show, the company will showcase newly developed products that offer solutions for some of the challenges the electronics industry is now facing, such as improvements in reliability, thermally stable joining, and lead-free die attach.

 

SN100CV™ P506 D4 is a lead-free, no-clean solder paste with its basic composition of (Sn-Cu-Ni-Ge). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV™ gains its strength from solute atoms in the tin matrix of the joint. The unique ability of SN100CV™ P506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes. The long open time ensures trouble-free performance in production processes.