As electronic products become smaller and thinner and have higher performance, components with lower heatproof temperature have come to be used. Such a tendency is not irrelevant to solder materials, and there has been an urgent need to develop low-melting-point solder materials that can be mounted at a lower temperature than conventional lead-free solder materials. Our fully prepared TempSave B37 P610 D4 not only enables lower temperature mounting but also greatly improves the impact resistance that has been a problem for Sn-Bi low-melting-point solder materials.