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< Product > NS-F851 Wave Soldering Flux
Good barrel fill and topside fillet formation
NS-F851 is flux for lead-free wave soldering. It facilitates solder drainage and ensures minimum bridges, thus providing secure mounting in wave soldering. Additionally, this flux allows excellent wetting and reliable solder joints.
Works perfectly with Sn-Cu-Ni solders as well as SAC305
NS-F851 works well with Sn-Ag-Cu solder (SAC305) and Sn-Cu-Ni solder (SN100C) Wave soldering lines running either type of alloy can be converted to NS-F851 with minimal inconvenience compared with an alloy change.
Comparison of Wetting and Barrel Fill
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IC DIP Soldering Conditions Preheat Temperature 105-115°C
Peak Temperature 245-250°C -
CN Tidley Connector Preheat Temperature 110-120°C
Peak Temperature 245-250°C
Solder drainage and probability of bridge occurrence
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Appearance of Solder Joints 〇Red circles show points where bridges occurred.
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Probability of bridge occurrence (Left) Preheat Temperature 105-115°C
Peak Temperature 245-250°C
(Right) Preheat Temperature 110-120°C
Peak Temperature 245-250°C
