On September 14, 2013 in Malaysia, NIHON SUPERIOR hosted a grand opening celebration for its newest research & development (R&D) center as well as the beginning of its joint research project with UniMAP, one of Malaysia’s highest ranking universities.

 

Guests from around the world gathered to help NIHON SUPERIOR commemorate the day. Tetsuro Nishimura, president of NIHON SUPERIOR, kicked off the event with a moving speech and gave special recognition to two distinguished guests: Dr. Kazuhiro Nogita, the founder and director of the NIHON SUPERIOR Center for the Manufacture of Electronic Materials at University of Queensland, Australia (NS CMEM), and Dato’ Dr. Kamarudin bin Hussin of the University of Malaysia Perlis (UniMAP). He added that the company’s ongoing joint R&D with universities in the USA, Europe, Australia, and now Malaysia, will further strengthen its global research network and customer support.

 

The R&D Center, located on the premises of NIHON SUPERIOR (Malaysia) Sdn Bhd, is fully operational and stocked with state-of-the-art equipment. NIHON SUPERIOR (Malaysia) Sdn Bhd is one of the company’s key production centers and is a fully integrated facility for the manufacture of the SN100C environmentally-friendly, lead-free solder alloy that is developed and patented in 24 countries.

 

During his speech to the guests, Nishimura said, “Ultimately, it is for you that we are establishing this NIHON SUPERIOR (M) Snd. Bhd. R&D Centre. We want to be closer to you so that we better understand your needs and respond to them faster with new and improved products. We want to be able to deliver faster and more effective technical support without the language barrier.”

 

He added that the company is proud that the R&D it is undertaking at its headquarters in Osaka, Japan is already well recognized in the industry. “As well as developing alloys and fluxes for metal joining, we feel that we are contributing to society through the technical support we provide to the industry,” he said, adding that equipment manufactured with its products is used in a range of climate conditions. As a result, the company tests performance in harsh environments in its R&D centers. Soldered assemblies are tested to the point of failure through electrical shorts or cracking in conditions of heat and humidity, vibration and electrical stress.

 

“ In Japan there is a saying about ‘building a Buddha without the spirit. ” Today, we are putting the spirit into this NIHON SUPERIOR (M) Snd. Bhd. R&D Centre,” Nishimura concluded.