NIHON　SUPERIOR's low melting point, lead-free solder alloy, TempSave B37, was praised as a notable welding technology for development of the industry and received the "" Welding Notable Invention Award "" from the Japan Welding Engineering Society.

 

TempSave B37 enables soldering at temperatures below 200°C, as well as featuring high alloy strength. Sn-Bi (tin-bismuth) eutectic alloy is widely known as a solder that can be used in similar temperature ranges. However, as the alloy is weak (i.e., mechanical strength is low), it applications were limited. The market is looking for strong solder that can be used in low temperatures. This was no easy task, and our R&D staff faced many difficulties.

 

This is the story of TempSave B37. We hope this metal bonding material helps improve modern society and the lives of everyone living in it.