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ICEP "Outstanding Technical Paper Award 2023" Winner
The International Conference on Electronics Packaging (ICEP), an annual international conference on packaging technology held in Japan, took place from April 17 to 20 at the Toyama International Conference Center in Toyama Prefecture.
At ICEP, researchers from around the world present their latest research. To foster competition and recognize excellence, the "Outstanding Technical Paper Award" is traditionally given to outstanding papers.
At ICEP, researchers from around the world present their latest research. To foster competition and recognize excellence, the "Outstanding Technical Paper Award" is traditionally given to outstanding papers.
The paper we co-authored with a university last year, titled "Controlling Porosity During Transient Liquid Phase Bonding for High Temperature Soldering Processes," has been awarded the "Outstanding Technical Paper Award" for 2023. The award ceremony was held at this year’s ICEP, where Professor Kazuhiro Nokita received the award on behalf of the researchers.
It is no exaggeration to say that reading the papers presented at ICEP provides a glimpse into the future of the packaging industry. All the papers presented at ICEP, including ours, are available on "IEEE Xplore." We encourage anyone interested to take a look.
(*)This research is a collaborative effort between Nihon Superior Co., Ltd., The University of Queensland, UniMAP (Universiti Malaysia Perlis), and Kyushu University.
