Product Information

ANP-8 (Copper-containing)

Product that ensures the bonding reliability of ANP-1 while cutting costs by using copper instead of silver as the filler. Compatible with pressure bonding.

Table of Features

  • Target Bonding Object

    Die / LED / Thermo-Electric Element, etc.

  • Bonding Area

    No-Pressure : Incompatibl
    Pressure : □15mm or more

  • Surface Treatment

    Au / Ag / Pt / Cu / Ni

  • Paste Viscosity

    50～200Pa・s

  • Metal Content Ratio

    75～90wt％

  • Storage Condition

    5～15℃

  • Recommended
    Bonding Condition

    No-Pressure : Incompatible
    Pressure : Keep 300℃ / 30MPa for 5 minutes

  • Recommended
    Bonding Layer Thickness

    ＞20μm

Table of Features of The Bonding Layer

  • Bonding strength

    Over 40Mpa

  • Thermal Conductivity

    350W/m・K

  • Melting Point

    About 960°C

  • Reliability

    Achieved 60,000 cycles in power cycle test
※The above feature values are of those during pressure sintering.
Please contact the person in charge for more details.