ANP Series (Sintered Silver Paste)
Alconano Silver Ｐａｓｔｅ：
A sintering-type bonding material composed of nanometer-sized silver particles (0.000001 mm) coated with alcohol derivatives.
This material enables reliable bonding not only to noble metals such as Ag (silver) and Au (gold), but also to base metals such as Cu (copper) and Ni (nickel), providing compatibility with a wide range of substrates.
Products
| Product Number | ANP-1 | ANP-8 |
|---|---|---|
| Particle Size | 50～300Pa・s | 50～300Pa・s |
| Sintering Temperature | 250℃↑×300sec | 300℃↑×300sec |
| Sintering Pressure | 10MPa↑ | 20MPa↑ |
| Thermal Conductivity | 330W/m・K | 350W/m・K |
| Shear Strength | 40MPa | 40MPa |
| Compatible Metals | Ag, Au, Pd, Pt, Cu, Ni | Ag, Au, Pd, Pt, Cu, Ni |
| Storage Conditions | 5～15℃ | 5～15℃ |
ANP-1 (General Purpose)
- Pressureless Sintering
- Pressure Sintering
- High Thermal Conductivity
- Direct Cu-to-Cu Bonding
ANP-1 is a sintering-type silver paste that enables bonding under both pressureless and pressure-assisted conditions.
By employing uniquely engineered nano-silver particles, it achieves reliable bonding not only with noble metals such as Ag and Au, but also with base metals such as Cu and Ni.
In addition to semiconductor dies for power modules, ANP-1 is also applicable to a wide range of electronic components, including power LEDs and thermoelectric devices.
■Bonding Area Capability
Pressureless up to □5 mm
With Pressure □15 mm or larger
ANP-8 (Copper-Containing Grade)
- Pressure Sintering
- High Thermal Conductivity
- Direct Cu-to-Cu Bonding
ANP-8 is a sintering-type silver paste that achieves cost reduction by reducing the usage of silver (Ag) while maintaining the high bonding strength and reliability of ANP-1.
Specialized for pressure-assisted sintering processes, ANP-8 is suitable for components with large bonding areas, such as large dies and heat spreaders.
■Bonding Area Capability
With Pressure □15 mm or larger
Application of Sintered Silver Pastes in Power Modules: Three Approaches
