ASTRO Series (Sintered Silver Paste)
With the addition of the ASTRO Series to the Alconano Sintered Silver Paste lineup — composed of nanometer-sized (0.000001 mm) silver particles coated with alcohol derivatives — our product portfolio has been further expanded.
The name “ASTRO” is derived from Acceleration of Sintering Technology for Reliability and Outperformance, reflecting our commitment to advancing sintering technology for superior reliability and performance.
Inheriting the proven characteristics of our existing products ANP-1 and ANP-8, the ASTRO Series features optimized particle composition and solvent formulations tailored to the specific requirements of each application stage.
By ensuring excellent printability, easy mounting, and reliable sintering performance throughout the entire bonding process — Printing → Mounting → Sintering — the ASTRO Series delivers next-generation bonding materials optimized for diverse applications.
Products
| Product Number | ASTRO-HP | ASTRO-LP | ASTRO-LN |
|---|---|---|---|
| Particle Size | 10～100Pa・s | 10～100Pa・s | 10～300Pa・s |
| Sintering Temperature | 250℃↑×300sec | 220℃↑×300sec | 250℃↑×60min |
| Sintering Pressure | 10MPa↑ | 20MPa↑ | － |
| Thermal Conductivity | 330W/m・K | 350W/m・K | 155W/m・K |
| Shear Strength | 30MPa | 20MPa | 20MPa |
| Compatible Metals | Ag, Au, Cu, Pd, Pt | Ag, Au, Pd, (Cu), Pt | Ag, Au, Pd, Pt |
| Storage Conditions | 5～20℃ | 5～20℃ | 5～20℃ |
ASTRO-HP
- Pressure Sintering
- High Thermal Conductivity
- Direct Cu-to-Cu Bonding
- Capable of Pre-Bonding
Die-Attach Bonding Material
ASTRO-HP is a sintering-type silver paste specifically designed for die-attach applications, developed with a focus on usability throughout the entire bonding process.
・Excellent thermal conductivity
・Dedicated design for pressure-assisted sintering
・Capable of pre-bonding after preliminary drying
・Compatible with Cu-to-Cu bonding
■Bonding Area Capability
With Pressure □15 mm or larger
ASTRO-LP
- Pressure Sintering
- High Thermal Conductivity
- Low-Temperature Sintering
- Suitable for Large-Area Printing
Bonding Material for High-Performance TIM
ASTRO-LP is a sintering-type silver paste specifically designed for TIM (Thermal Interface Material) applications.
In addition to excellent printability for large-area coverage, it enables sintering at temperatures below the heat resistance limit of molding resins.
This makes it suitable for use with heat-sensitive packaging materials, while ensuring both stable thermal conductivity and reliable bonding quality.
・Excellent thermal conductivity
・Dedicated design for pressure-assisted sintering
・Low-temperature sintering compatible with module assembly
・Rheological properties optimized for large-area dispensing/printing
■Bonding Area Capability
With Pressure □15 mm or larger
ASTRO-LN
- Pressureless Sintering
- High Thermal Conductivity
- Capable of Sintering in N₂ or Air Atmosphere
- Void-Free
Bonding Material for Pressureless Devices
ASTRO-LN is a sintering-type silver paste specifically developed for pressureless bonding applications, such as chips where pressure-assisted bonding is difficult.
With its unique particle design, it significantly reduces void formation — a common issue in conventional pressureless bonding.
This enables high bonding reliability and stable sintering quality, even for devices where pressure application is challenging.
■Bonding Area Capability
Pressureless □5 mm or smaller
Application of Sintered Silver Pastes in Power Modules: Three Approaches
