Product Information

No-Clean Fluxes for PCB Assembly – Product LineUp

Product number NS-F850 NS-F851 NS-F901 NS-F902
Application General purpose General purpose General purpose General purpose / Suitable for Sn-Bi low-temperature solder
Features Excellent solder separation / Excellent wettability Excellent solder separation / Excellent wettability Excellent wettability
Completely halogen-free 		Completely halogen-free
Flux classification ROL1 ROM1（ROL1) ROM0 ROM0
Halogen content Contained Contained - -
Halide content 0.09 mass％ 0.08 mass％ 0.00 mass％ 0.00 mass％
Specific gravity 0.826 0.829 0.822 0.829
Solid content 16.0 mass％ 15.5 mass％ 15.0 mass％ 15.2 mass％
Insulation resistance ≧1.0×109 ≧1.0×109 ≧1.0×1010 ≧1.0×109

NS-F850

  • General purpose
  • Compatible with spraying and foaming
  • Category : ROM1 (ROL1)
  • Contains halogen

Excellent wettability, through-hole solder climbing, and solder separation performance.

Excellent wettability, through-hole solder climbing, and solder separation performance.

NS-F850 is an ideal post-flux for lead-free soldering processes of printed circuit boards mounted with chip components and discrete devices.
 
・Excellent solder separation
・Excellent wettability
・Effective bridge suppression
・Matte surface finish
It provides excellent through-hole solder climbing performance and forms a uniform solder fillet, ensuring highly reliable solder joints.

Left : Comparison product (bridging observed)
Right : NS-F850

Handling Precautions
・Always perform concentration control when using NS-334 (Dedicated diluent : NS-700).
・Concentration control is not required when using spray application.

NS-F851

  • General purpose
  • Compatible with spraying and foaming
  • Category: ROM1 (ROL1)
  • Contains halogen

Excellent solder separation, bridge suppression, and reliable assembly quality

Excellent solder separation, bridge suppression, and reliable assembly quality

NS-F851 is a post-flux designed for lead-free soldering processes.
It offers excellent solder separation and superior wettability. Even on fine-pitch pads, it significantly reduces the occurrence of bridging, contributing to reliable and stable assembly quality in flow soldering processes.
 
・Excellent solder separation
・Excellent wettability
・Effective bridge suppression
・Improved filter maintenance performance

Excellent Solder Separation (Suppresses Bridge Formation)

Excellent Solder Separation (Suppresses Bridge Formation)

Left : Comparison product (bridging observed)
Righ t: NS-F851
 
NS-F851 provides excellent solder separation properties and effectively suppresses bridge formation, even in fine-pitch assembly conditions.

Reduced Fluxer Filter Clogging

Reduced Fluxer Filter Clogging

Left : Comparison product (Primary filter: Day 2)
Right : NS-F851 (Primary filter: Day 4)
 
Compared to conventional fluxes, NS-F851 reduces fluxer filter clogging by approximately 50%, greatly improving maintenance performance.

NS-F901

  • Completely halogen-free
  • Compatible with spraying and foaming
  • Category : ROM0
  • Not contains halogen

Completely Halogen-Free Type.
Matte Finish After Assembly — Helps Prevent Defect Oversight

Completely Halogen-Free Type.
Matte Finish After Assembly — Helps Prevent Defect Oversight

NS-F901 is a highly reliable, completely halogen-free post-flux containing no halogen elements (F, Cl, Br, or I).
By producing a matte solder surface after assembly, it significantly improves the efficiency of visual inspection and helps prevent defects from being overlooked.
 
・Excellent solder separation
・Excellent wettability
・Effective bridge suppression
・Matte surface finish

Matte Finish with Reduced Gloss After Assembly

Matte Finish with Reduced Gloss After Assembly

Left : Conventional product
Right : NS-F901

NS-F902

  • Completely halogen-free
  • Compatible with Sn-Bi low-temperature solder
  • Categoty : ROM0
  • Not contains halogen

Completely halogen-free.
Also suitable for assembly processes using Sn-Bi low-temperature solder.

Completely halogen-free.
Also suitable for assembly processes using Sn-Bi low-temperature solder.

NS-F902 is a highly reliable post-flux that contains no halogen elements (F, Cl, Br, or I).
It provides excellent solder separation and outstanding wettability, enabling reliable and stable soldering performance.
It is also suitable for wave soldering processes using low-melting-point solders (Sn-Bi systems).
 
・Excellent solder separation
・Excellent wettability
・Effective bridge suppression
・Improved filter maintenance performance

Excellent Wettability (FR-4 Substrate / CN Chidori Connector)

Excellent Wettability (FR-4 Substrate / CN Chidori Connector)

Right : SEM image of solder joints assembled with NS-F902
Through-hole wettability is also excellent.

Evaluation with Low-Melting-Point Solder

Evaluation with Low-Melting-Point Solder

Left : Conventional product
Right : NS-F902
 
When using Sn-Bi solder, NS-F902 effectively suppresses the occurrence of solder residue adhesion.

Other Soldering Flux Product Lineup

Product number NS-316F-7 NS-334
Application Printed circuit boards / harness terminal processing Hot-dip plating of lead frames
Type ow-residue resin-based Low-residue organic acid-based
Suitable base materials Copper and copper alloys Copper and copper alloys
Halogen content - -
Dedicated diluent NS-700 NS-700
Soldering method Flow soldering, dipping Dipping
Remarks Low-residue, no-clean type. Be sure to control the concentration using the specified thinner. Low-residue, no-clean type. Be sure to control the concentration using the specified thinner.

NS-316F-7 (Resin-Based, Low-Residue, No-Clean Flux)

No-Clean / Halogen-Free
NS-316F-7 is a low-residue, no-clean flux developed to eliminate the need for post-solder cleaning processes.
Its halogen-free formulation ensures environmental compliance while maintaining high reliability.
It is compatible with spray fluxers, supports foaming application, and is suitable for dual-wave soldering processes.

Features
・Low-residue, no-clean type
・Effectively suppresses solder balls, bridging, icicles, and other soldering defects
・Allows board inspection even without post-solder cleaning
・Does not interfere with the contact reliability of connectors or switches
・Minimizes equipment contamination and reduces maintenance requirements

Handling Precautions
Always perform concentration control when using NS-316F-7 (Dedicated diluent : NS-700).
Concentration control is not required when using spray application.

NS-334 (Organic Acid-Based, Low-Residue, No-Clean Flux)

No-Clean / Halogen-Free
NS-334 is an alcohol-based no-clean soldering flux.
It contains no halogen or resin, and because of its low solid content, it leaves only a minimal amount of inert residue that does not affect electrical performance.
Furthermore, since it contains no water, spattering and splashing during soldering are minimized, and a bright, smooth solder surface can be obtained after soldering.

Features
・Low-residue, no-clean type
・Compatible with various application methods including dipping, spraying, and foaming
・Suitable for both single- and double-sided PCBs (with or without solder coating)
・Ideal for tin plating of insulated wires, stranded wires, and solder coating of printed circuit boards
・Free from rosin and resin
・Enables total cost reduction by eliminating cleaning processes, reducing solvent usage, and lowering labor costs

Handling Precautions
Always perform concentration control when using NS-334 (recommended dedicated diluent: NS-700).
Concentration control is not required when using spray application.