Item	NS-316F-7	NS-334
Application	Printed circuit boards / Wire harness terminal treatment	Molten tin plating of lead frames
Type	Low-residue resin-based	Low-residue organic acid-based
Suitable base materials	Copper and copper alloys	Copper and copper alloys
Halogen content	-	-
Dedicated diluent	NS-700	NS-700
Soldering method	Flow soldering, Dipping	Dipping
Remarks	Low-residue, no-clean type. Always perform concentration control using the dedicated diluent.	Low-residue, no-clean type. Always perform concentration control using the dedicated diluent.

No-Clean / Halogen-Free

NS-334 is an alcohol-based, no-clean soldering flux.

It contains no halogen or resin, and because of its low solid content, it leaves only a minimal amount of inert residue that does not affect electrical performance.

Furthermore, since it contains no water, spattering and splashing during soldering are minimized, and a bright, smooth finish can be achieved after soldering.

Features

・Low-residue, no-clean type

・Compatible with various application methods including dipping, spraying, and foaming

・Suitable for both single- and double-sided PCBs (with or without solder coating)

・Ideal for tin plating of insulated wires and stranded wires, as well as solder coating of printed circuit boards

・Free from rosin and resin

・Enables total cost reduction by eliminating cleaning processes, reducing solvent usage, and lowering labor costs

Handling Precautions

Always perform concentration control when using NS-334 (Dedicated diluent : NS-700).

Concentration control is not required when using spray application.

No-Clean / Halogen-Free

S-316F-7 is a low-residue, no-clean flux developed to eliminate the need for post-solder cleaning processes.

Its halogen-free formulation ensures environmental compliance while maintaining high reliability.

It is compatible with spray fluxers, supports foaming application, and is suitable for dual-wave soldering processes.

Features

・Low-residue, no-clean type

・Effectively suppresses solder balls, bridging, icicles, and other soldering defects

・Allows board inspection even without post-solder cleaning

・Does not interfere with the contact reliability of connectors and switches

・Minimizes equipment contamination, reducing maintenance requirements

Handling Precautions

Always perform concentration control when using NS-316F-7  (Dedicated diluent : NS-700).

Concentration control is not required when using spray application.