Product Information

NS Flux-Cored Solder

We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application.

101

This formula is designed so that the incidence of bridging is rare; likewise when the soldering iron is removed the formula retains its shape and does not form nubs that follow the tip of the iron. The resin contains elements that are dispersed when heated (by the soldering iron) in addition to constituents that group together when heated. After the solder is applied the resin settles and remains on the top of the solder. In this fashion, should you find that you need to solder a portion again, the top layer of resin allows you to perform the task simply and easily with the soldering iron alone.

010

The RMA type formula is highly reliable, very workable and can be used for fine pitch applications. As RMA is a non-chlorine formula, dispersal is minimal. RMA also possesses excellent insulation properties. It is suitable for use with lead-free solder.

210

Another non-chlorine formula with a rapid coefficient of wetness. Dispersal is minimal, with little or no bridging or nub formation following the withdrawal of the soldering iron. This formula is planned to shorten the operational time required to complete a soldering task. Is also suitable for use with lead-free solder.

110M

This formula reduces post-solder difficulties with inspections etc., by minimizing bridging, possessing excellent wetness properties and eliminating the majority of dross after the solder has been applied. Moreover, as flux dross is very reliable, this formula is suitable to be applied without the need for any washing.
 
110M : Suitable for robot-welding jobs

Table Showing the Properties of Flux

Classification General Type No-Clean Highly Active Type No-Clean Highly Active Type No-Clean Transparent Residue Type
Flux Number 101 10 210 110M
Flux Type JIS Z 3283 Class A JIS Z 3283 Class AA JIS Z 3283 Class A JIS Z 3283 Class A
Flux Content (%) 2.0 3.0 2.5 2.0
Degree of Dryness Passed Passed Passed Passed
Halogen Content (%) ≦0.4 ≦0.05 ≦0.4 ≦0.4
Copper Plate Corrosion Passed Passed Passed Passed
Copper Mirror Corrosion Passed Passed - Passed
Silver Chromate Paper - Passed - -
Resistance to Solubility (Ωm) ≧1000 ≧2000 ≧500 ≧1000
Insulation Resistance (Ωm) 85°c 85% RH Comb Pattern II ≧1.0×10⁹ ≧1.0×10⁹ ≧1.0×10⁹ ≧1.0×10⁹
※Expansion Ratio (%) ≧90 ≧85 ≧90 ≧90
※hese values may differ due to the metal alloys/flux content and the diameter of the wire used.
For soldering robots the special flux content i