NS-30 / NS-52 (Organic Acid Water Soluble Flux for Electronic Use)
Halogen-Free
Our non-halide organic acid type water soluble flux, designed for those applications where use of halogen must be avoided, is suitable for all sorts of applications such as electronic components, semi-conductors and the solder plating of printed circuit boards.
This non-halide series offers the same high performance when used with metals such as copper, 42 alloy and nickel as conventional halogen-based flux.
Lineup
・NS-52 : Halogen free
・NS-30 : Contains Halogen (content 1.4%)
NS-334 (Organic Acid Type / Low Residue No-Clean Flux)
Halogen-Free
NS-334 is an alcohol-based no-clean solder flux. As the flux does not contain halogen, the ratio of solid content is low, which translates into very little residual dross. Moreover, as NS-334 does not contain any water, there is no dispersion whatsoever. Soldering with NS-334 leaves a brilliant varnish-like hue.
Characteristic
・Can be used as a dip, spray or foam.
・Ideal for use with single-sided or double sided circuit boards (with or without solder coating).
・Perfect for tinning and coating covered or stranded wires and for solder coating printed circuit boards.
・Does not contain any rosin or resin.
・Using NS-334 can have a positive impact on your cleaning machinery, solvent and staffing costs.
Precautions for Use
When using MS-316 and/or NS-334 please be sure to control the concentration of the flux.
(This is not necessary in the case of a spray-type flux)
NS-334 (Organic Acid Type / Low Residue No-Clean Flux)
| Item | NS-316F-7 | NS-316F-8 | NS-334 |
Test method JIS-Z-3197 |
|---|---|---|---|---|
| Classification | Resin-based low-residue type | Resin-based low-residue type | Organic low-residue type | N/A |
| Color tone | Transparent light yellow | Transparent light yellow | Light brown | Visual observation |
| Solid content (WT %) | 6 | 3 | 4.7 | Dried for 15 mins at 145°C |
| Dryness | Passed | Passed | Passed | 6.2 |
| Specific gravity (20°C) | 0.801 | 0.8 | 0.8 | 6.4 |
| Halogen content (WT %) | ０ | ０ | ０ | 6.5 |
| Copper board corrosion test | Passed | Passed | Passed | 6.6.1 |
| Copper mirror corrosion test | Passed | Passed | Passed | 6.6.2 |
| Insulation resistance (Ω) color tone [initial value] | 1×10¹³or more | 1×10¹³or more | 1×10¹³or more | 6.8 |
| Insulation resistance (Ω) color tone [after moisturization] | 1×10¹²or more | 1×10¹¹or more | 1×10¹³or more | 6.8 |
| Insulation resistance (Ω) color tone [initial value] | 1×10¹³or more | 1×10¹³or more | 1×10¹³or more | 6.9 |
| Insulation resistance (Ω) color tone [after moisturization] | 1×10¹²or more | 1×10¹¹or more | 1×10¹³or more | 6.9 |
| Insulation resistance (Ω) color tone [visual observation] | No corrosion | No corrosion | No corrosion | 6.9 |
| Expansion test (%) | 80or more | 80or more | 80or more | 6.10 |
| Cleanness μgNaCl/cm² | 1.7 | 1.6 | - | MIL-P28809 4.8.7 |
| pH | 3.8 | 3.8 | 4.3 | pH meter |
| Acid value mgKOH/g | 21 | 17 | 32 | JIS-K-5902 5.4 |
| Flash point (°C) | 12 | 12 | 12 | Closed type |
| Dedicated diluent | NS-700 | NS-770 | NS-700 | - |
| Remarks |
Highly reliable Foaming Compatible with single wave soldering |
Single wave soldering For soldering pots |
- | - |
RM-5 (Flux for BGA / CSP Solder Ball)
Ideal for coating/printing, RM-5 is a highly reliable RMA-type smooth flux.
RM-5 (Flux for BGA / CSP Solder Ball)
| Flux type | RMA | Test Method |
|---|---|---|
| Halide content (mass%) | 0.02±0.005 | JIS Z 3197 6.5 |
| Expansion rate (%) * | 80 or more | JIS Z 3197 6.10. |
| Insulation resistance (Ω) [initial] | 1×10¹³or more |
JIS Z 3197 6.8 JIS Z 3197 6.10. |
| Insulation resistance (Ω) [after 96 hrs.] | 1×10¹¹or more |
JIS Z 3197 6.8 JIS Z 3197 6.10. |
| Humidity resistance under DC voltage (Ω) [initial] | 1×10¹³or more | JIS Z 3197 6.9 |
| Humidity resistance under DC voltage (Ω) [after 96 hrs.] |
1×10¹¹ or more No corrosion |
JIS Z 3197 6.9 |
| Application | Printing, coating | - |
Packaging uni t : plastic jar containing 100 g of product
* Solder used : Sn63Pb37