Lead-Free Solder Products
We want to help create a brighter and more prosperous future where there is no conflict between the employment of the most advanced technologies and the protection of the global environment. Our goal is to supply better products to our customer by our continuing quest of technical innovation and cost reduction.
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Silver-free, lead-free solder alloy that is certified by ISO.
[ Highly reliable alloy / Silver-free ]
SN100C (standard lead-free solder)
New alloy made by adding bismuth (Bi) to the SN100C alloy composition. SN100CV has enhanced strength and heat resistance.
Lead-free solder alloy containing 3% silver (Ag). One of the world's standard alloys.
[ Highly reliable alloy / Silver-containing (SAC305) ]
Alloy with high crack resistance. Recommended for in-vehicle and related products that require high reliability and durability.
[ Crack resistant / High-strength alloy / Silver-containing ]
Special alloy developed for soldering automotive heated wire glass to terminals, among other applications.
[ Silver leaching prevention alloy / Silver-free ]
Special alloy that enables soldering of aluminum to copper. Garnering attention as a bonding material for automotive aluminum wires.
[ Alloy for aluminum bonding / Silver-containing ]
New alloy developed exclusively for flux-cored solder. Significantly reduces soldering tip wear.
[ Tip wear prevention alloy / Silver-free ]
Low temperature, lead-free solder alloy that enables soldering of flex circuits and parts with low temperature resistance.
[ Low melting point alloy / Silver-free ]
Refine your search of Lead Free Solder Product
Search for the best lead-free solder products by shape, alloy, application, features, and other criteria.
The need for high-quality soldering materials and equipment is rapidly growing to enable the production of smaller, lighter, and thinner electronic devices. We provide a wide range of reliable products to satisfy diverse customer needs.
Flux products play a vital part in ensuring the finish and quality of metal bonding. We provide an array of products that improve bonding quality with features such as oxide film removal and enhanced wetting.
Alconano Nano-Silver Paste
These products are next-generation bonding materials in which nanometer-size (0.000001 mm) silver particles are covered with alcohol derivatives. Thanks to its excellent conductivity, the product is garnering attention as a die bonding material for semiconductors and thermoelectric devices.