Lead-Free Solder

Lead-Free Solder Products

We want to help create a brighter and more prosperous future where there is no conflict between the employment of the most advanced technologies and the protection of the global environment. Our goal is to supply better products to our customer by our continuing quest of technical innovation and cost reduction.

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Solder Bar

Solder Wire (Flux-Cored Solder Wire)

Solder Paste for Printing Grade

Solder Paste for Dispensing Grade

Solder Ball

Solder Preform

Search by Alloy

SN100C

Sn-Cu-Ni-Ge

Silver-free, lead-free solder alloy that is certified by ISO.
[ Highly reliable alloy / Silver-free ]

SN100C (standard lead-free solder)

SN100CV

Sn-Cu-Ni+Ge+Bi

New alloy made by adding bismuth (Bi) to the SN100C alloy composition. SN100CV has enhanced strength and heat resistance.

SN97C

Sn-Ag-Cu

Lead-free solder alloy containing 3% silver (Ag). One of the world's standard alloys.
[ Highly reliable alloy / Silver-containing (SAC305) ]

LF-C2

Sn-Ag-Cu-Bi

Alloy with high crack resistance. Recommended for in-vehicle and related products that require high reliability and durability.
[ Crack resistant / High-strength alloy / Silver-containing ]

LF-Z3

Sn-Zn

Special alloy developed for soldering automotive heated wire glass to terminals, among other applications.
[ Silver leaching prevention alloy / Silver-free ]

ALUSAC-35

Sn-Ag-Cu-Ni

Special alloy that enables soldering of aluminum to copper. Garnering attention as a bonding material for automotive aluminum wires.
[ Alloy for aluminum bonding / Silver-containing ]

TipSave N

Sn-Cu-Ni-Ge (+α)

New alloy developed exclusively for flux-cored solder. Significantly reduces soldering tip wear.
[ Tip wear prevention alloy / Silver-free ]

TempSave

Sn-Bi / Sn-Bi-Cu (+α)

Low temperature, lead-free solder alloy that enables soldering of flex circuits and parts with low temperature resistance.
[ Low melting point alloy / Silver-free ]

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Refine your search of Lead Free Solder Product

Search for the best lead-free solder products by shape, alloy, application, features, and other criteria.

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Application

Feature

Alloy

- products are match your selection
  • For component termination
  • High strength
  • General-purpose
  • For wave soldering
  • For selective soldering
  • For fine pitch soldering
  • For hot air solder leveling
  • Nozzle erosion prevention
  • Solder foil
  • Compatible with hot temperature soldering
  • For low temperature soldering
  • 自動はんだ付け機対応
  • Compatible with laser soldering
  • Tip wear prevention
  • For aluminum bonding
  • For joining heated wire glass (automobile)
  • Non-core type (bobbinless)
  • For (compatible with) formic acid reflow
  • For micro soldering
  • Crack and impact resistant
  • Washing unnecessary
  • For BGA, CSP, MCM
  • Silver-free
  • Silver-containing
  • Bridge prevention
  • Good workability
  • Reduced burning
  • Spattering prevention
  • Completely halogen-free
  • High strength
  • Improved impact resistance
  • Good impact resistance
  • Galvanic corrosion prevention
  • Silver leaching prevention
  • Waste reduction
  • 12-month shelf life
  • Low voiding
  • Low residue
  • Good continuous dispensing capability
  • Diverse forms
  • SN100C
  • SN100CV
  • SN97C
  • LF-C2
  • LF-Z3
  • ALUSAC-35
  • TipSave N
  • TempSave

Search by alloy

Select alloy system

Narrow down your search by selecting criteria

Multiple selections allowed

Add condition
Narrow down your search by selecting criteria

Please select your criteria and press the "Decide" button.

Application

Feature

Alloy

- products are match your selection
  • For component termination
  • High strength
  • General-purpose
  • For wave soldering
  • For selective soldering
  • For fine pitch soldering
  • For hot air solder leveling
  • Nozzle erosion prevention
  • Solder foil
  • Compatible with hot temperature soldering
  • For low temperature soldering
  • 自動はんだ付け機対応
  • Compatible with laser soldering
  • Tip wear prevention
  • For aluminum bonding
  • For joining heated wire glass (automobile)
  • Non-core type (bobbinless)
  • For (compatible with) formic acid reflow
  • For micro soldering
  • Crack and impact resistant
  • Washing unnecessary
  • For BGA, CSP, MCM
  • Silver-free
  • Silver-containing
  • Bridge prevention
  • Good workability
  • Reduced burning
  • Spattering prevention
  • Completely halogen-free
  • High strength
  • Improved impact resistance
  • Good impact resistance
  • Galvanic corrosion prevention
  • Silver leaching prevention
  • Waste reduction
  • 12-month shelf life
  • Low voiding
  • Low residue
  • Good continuous dispensing capability
  • Diverse forms
  • SN100C
  • SN100CV
  • SN97C
  • LF-C2
  • LF-Z3
  • ALUSAC-35
  • TipSave N
  • TempSave

Other Categories

Solder (Lead-Containing)

Solder (Lead-Containing)

The need for high-quality soldering materials and equipment is rapidly growing to enable the production of smaller, lighter, and thinner electronic devices. We provide a wide range of reliable products to satisfy diverse customer needs.

Soldering Flux

Soldering Flux

Flux products play a vital part in ensuring the finish and quality of metal bonding. We provide an array of products that improve bonding quality with features such as oxide film removal and enhanced wetting.

Alconano Nano-Silver Paste

Alconano Nano-Silver Paste

These products are next-generation bonding materials in which nanometer-size (0.000001 mm) silver particles are covered with alcohol derivatives. Thanks to its excellent conductivity, the product is garnering attention as a die bonding material for semiconductors and thermoelectric devices.