Lead-Free Solder

Solder Preform Products

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Search for the best lead-free solder products by shape, alloy, application, features, and other criteria.

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Application

Feature

Alloy

- products are match your selection
  • For component termination
  • High strength
  • General-purpose
  • For wave soldering
  • For selective soldering
  • For fine pitch soldering
  • For hot air solder leveling
  • Nozzle erosion prevention
  • Solder foil
  • Compatible with hot temperature soldering
  • For low temperature soldering
  • 自動はんだ付け機対応
  • Compatible with laser soldering
  • Tip wear prevention
  • For aluminum bonding
  • For joining heated wire glass (automobile)
  • Non-core type (bobbinless)
  • For (compatible with) formic acid reflow
  • For micro soldering
  • Crack and impact resistant
  • Washing unnecessary
  • For BGA, CSP, MCM
  • Silver-free
  • Silver-containing
  • Bridge prevention
  • Good workability
  • Reduced burning
  • Spattering prevention
  • Completely halogen-free
  • High strength
  • Improved impact resistance
  • Good impact resistance
  • Galvanic corrosion prevention
  • Silver leaching prevention
  • Waste reduction
  • 12-month shelf life
  • Low voiding
  • Low residue
  • Good continuous dispensing capability
  • Diverse forms
  • SN100C
  • SN100CV
  • SN97C
  • LF-C2
  • LF-Z3
  • ALUSAC-35
  • TipSave N
  • TempSave

Search by alloy

Select alloy system

Narrow down your search by selecting criteria

Multiple selections allowed

Add condition
Narrow down your search by selecting criteria

Please select your criteria and press the "Decide" button.

Application

Feature

Alloy

- products are match your selection
  • For component termination
  • High strength
  • General-purpose
  • For wave soldering
  • For selective soldering
  • For fine pitch soldering
  • For hot air solder leveling
  • Nozzle erosion prevention
  • Solder foil
  • Compatible with hot temperature soldering
  • For low temperature soldering
  • 自動はんだ付け機対応
  • Compatible with laser soldering
  • Tip wear prevention
  • For aluminum bonding
  • For joining heated wire glass (automobile)
  • Non-core type (bobbinless)
  • For (compatible with) formic acid reflow
  • For micro soldering
  • Crack and impact resistant
  • Washing unnecessary
  • For BGA, CSP, MCM
  • Silver-free
  • Silver-containing
  • Bridge prevention
  • Good workability
  • Reduced burning
  • Spattering prevention
  • Completely halogen-free
  • High strength
  • Improved impact resistance
  • Good impact resistance
  • Galvanic corrosion prevention
  • Silver leaching prevention
  • Waste reduction
  • 12-month shelf life
  • Low voiding
  • Low residue
  • Good continuous dispensing capability
  • Diverse forms
  • SN100C
  • SN100CV
  • SN97C
  • LF-C2
  • LF-Z3
  • ALUSAC-35
  • TipSave N
  • TempSave

Other Categories

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