SN100C
Solder Bar
- Melting Point
- 227-340℃
- Alloy
- Sn-Cu-Ni
Products
| Product Number | SN100C | SN100C3 | SN100C4 | SN100CL |
|---|---|---|---|---|
| Application | For BGA, CSP, MCM | For component terminationCompatible with hot temperature soldering | For component terminationCompatible with hot temperature soldering | For fine pitch solderingFor hot air solder leveling |
| Type and Feature | Silver-freeGood impact resistance | Silver-free | Silver-free | Silver-freeBridge prevention |
| Alloy | Sn-0.7Cu-0.05Ni-Ge | Sn-3.0Cu-0.05Ni-Ge | Sn-4.0Cu-0.05Ni-Ge | Sn-0.7Cu-0.05Ni-Ge |
| Melting Point | 227℃ | 227-310℃ | 227-340℃ | 227℃ |
SN100C
- For wave soldering / For selective soldering
- Silver-free / Bridge prevention
Our best selling solder bar product
With a 20-year-plus track record, SN100C is our best selling lead-free solder bar that is used all over the world.
- High fluidity
- Excellent wetting
- Prevents shrinkage cavities
- Prevents copper erosion
- Forms stable alloy layer
Enables bridge-free soldering
Enables bridge-free soldering
Its excellent wetting and good solder drainage enable bridge-free soldering. The photo shows an example using a 0.5-mm-pitch QFP.Automatic feeding solder wire
Automatic feeding solder wire
We also offer various types of SN100C solder wire used for automatic feeding to solder pots.
Lineup (examples)
- SN100C wire diameter 3.0 mm x 20 kg roll
- SN100CL (for copper concentration adjustment) wire diameter 3.0 mm x 20 kg roll
SN100C3 / SN100C4
- For component termination / Compatible with hot temperature soldering
- Silver-free
Can be used at hot temperatures of up to approx. 400°C
Solder for hot temperature processes suitable for copper lead wires, urethane-coated wires, component termination, etc. The minimal copper erosion helps minimize wire wear in hot temperatures and ultra-fine wire dipping processes. The product also minimizes copper erosion.
SN100CL
- For fine pitch soldering / Compatible with hot temperature soldering
- Silver-free
Ideal for hot air solder leveling on printed circuit boards
Solder for hot temperature processes suitable for copper lead wires, urethane-coated wires, component termination, etc. The minimal copper erosion helps minimize wire wear in hot temperatures and ultra-fine wire dipping processes. The product also minimizes copper erosion.