SN97C
Solder Paste for Printing Grade
- Melting Point
- 218-219℃
- Alloy
- Sn-Ag-Cu
Products
| Product Number | SN97C P506 D4 | SN97C P608 D4（D5） | SN97C P820-5 D4 |
|---|---|---|---|
| Variation | (D4) | (D4・D5) | (D4) |
| Application | General-purpose(D4) | General-purpose(D4)For micro soldering(D5) | Washing unnecessary |
| Type and Feature | Silver-containing12-month shelf life | Silver-containingCompletely halogen-freeLow voiding | Silver-containingCompletely halogen-freeLow voidingLow residue |
| Alloy | Sn-3.0Ag-0.5Cu | Sn-3.0Ag-0.5Cu | Sn-3.0Ag-0.5Cu |
| Melting Point | 218-219 | 218-219 | 218-219 |
| Flux | P506 | P608 | P820-5 |
| Flux Category | ROM1（ROL1） | ROL0 | ROL0 |
| Presence of Halogen Elements | Yes | Completely halogen-free | Yes |
| Particle Size | D4 (Type 4)：20-38µm | D4 (Type 4)：20-38µm / D5 (Type 5)：10-25µm | D4 (Type 4)：20-38µm |
SN97C P506 D4
- General-purpose / For micro soldering
- Silver-containing / 12-month shelf life
Easy to use with a nice finish. Ideal for a wide range of soldering applications.
General-purpose, lead-free solder paste suitable for a wide range of soldering applications. Its stable viscosity makes it possible to maintain consistent print quality even when repeating storage (refrigeration) followed by use after adding at room temperature. It contains a silver-free, high strength alloy.
- Good quality in repeated printing
- Good wetting
- Prevents chip-side balls
Good wetting at the lead end face
Good wetting at the lead end face
Photo (Left) : SOT23-3 pin
Photo (Right) : 0.4-mm pitch QFP
Exhibits good wetting in unplated lead terminals too, forming nice fillets from the base to tip.
SN97C P608 D4 (D5)
- General-purpose / For micro soldering
- Silver-containing / Completely halogen-free / Low voiding
Both environmentally friendly (completely halogen-free) and reliable (low voiding)
Reduces voiding compared to conventional products
Reduces voiding compared to conventional products
Completely halogen-free solder paste that reduces voids, which cause critical problems in mounting. It exhibits wetting equivalent to or better than that of halogen-containing products. It contains a silver-free, high strength alloy.
Picture (Left) : conventional product used (x-ray photo taken after reflow)
Picture (Right) : P608 used (x-ray photo taken after reflow)
SN97C P820-5 D4
- Washing unnecessary
- Silver-containing / Completely halogen-free / Low voiding / Low residue
Makes the washing process after reflow unnecessary because it eliminates flux residue
SEM/EDS mapping analysis of soldering joint
SEM/EDS mapping analysis of soldering joint
Low-residue solder paste that minimizes flux residue. As it eliminates residue, the washing process after mounting is unnecessary. It contains only a small amount of components that gasify when melting, which helps prevent voiding as well.
Photo : We did not detect any organic substances (carbon) remaining as flux residue.