LF-C2
Solder Paste for Printing Grade
- Melting Point
- 208-213℃
- Alloy
- Sn-Ag-Cu
Products
| Product Number | LF-C2 P608 D4 |
|---|---|
| Variation | (D4) |
| Application | Crack and impact resistant |
| Type and Feature | Silver-containingCompletely halogen-freeHigh strengthLow voiding |
| Alloy | Sn-3.5Ag-1.0Cu-3.0Bi |
| Melting Point | 208-213℃ |
| Flux | P608 |
| Flux Category | ROL0 |
| Presence of Halogen Elements | Completely halogen-free |
| Particle Size | D4 (Type 4)：20-38µm |
LF-C2 P608 D4
- Crack and impact resistant
- Silver-containing / Completely halogen-free / High strength / Low voiding
Crack-resistant, high-strength solder paste that meets in-vehicle requirements
Crack-resistant, high-strength, lead-free solder paste. Ideal for soldering in-vehicle products and other products that require absolute reliability.
- Crack resistant
- Impact resistant
- Heat cycle resistant
- Reduces voids
Comparison of fillet cross sections after 2,000 heat cycles
Comparison of fillet cross sections after 2,000 heat cycles
Photo (Left) : SAC305 (Sn-3.0Ag-0.5Cu)
Photo (Right) : LF-C2 (Sn-3.5Ag-1.0Cu-3.0Bi)
LF-C2 maintains a joint state without cracking even after 2,000 cycles (1 cycle: -45°C/+125°C).
Reduces voiding (compared to SA305)
Reduces voiding (compared to SA305)
Photo (Left) : SAC305 (Sn-3.0Ag-0.5Cu)
Photo (Right) : LF-C2 (Sn-3.5Ag-1.0Cu-3.0Bi)
LF-C2 reduces voiding that causes problems in surface mounting.
Satisfies requirements for in-vehicle product reliability
