Product Information

TempSave

Solder Paste for Printing Grade
Melting Point
139-174℃
Alloy
Sn-Bi

Products

Product Number TempSave B37 P610 D4 TempSave B58 P610 D4
Variation (D4) (D4)
Application For low temperature soldering For low temperature soldering
Type and Feature Silver-freeImproved impact resistance Silver-freeLow voiding
Alloy Sn-0.5Cu-Ni-37Bi (+ other) Sn-58Bi
Melting Point 139-174℃ 139℃
Flux P610 P610
Flux Category ROL0 ROL0
Presence of Halogen Elements Completely halogen-free Completely halogen-free
Particle Size D4 (Type 4)：20-38µm D4 (Type 4)：20-38µm
Request for product catalog/SDS

TempSave B37 P610 D4

  • For low temperature soldering
  • Silver-free / Improved impact resistance

Resistant to impact! Improves the impact resistance of Sn-Bi solders

Impact-resistant, low-melting-point, lead-free solder paste. Ideal for products with a high risk of being dropped, such as mobile devices. It enables low temperature soldering, which helps prevent board warping.
 
- Impact resistant
- Energy saving (reduces power consumption during soldering by 20 to 30%)
- Halogen free

Comparison of fracture surface after ball shear test (SEM)

Comparison of fracture surface after ball shear test (SEM)

Photo (Left) : Sn-58Bi
Photo (Right) : TempSave B37
 
The one with a broader solder area (TempSave B37) has better stress absorbing capacity.

Ideal for mounting on thin boards (prevents board warping)

Ideal for mounting on thin boards (prevents board warping)

Since it can be used for mounting at a temperature range below 200°C, it prevents warping in thin boards that are used in mobile devices, wearable devices, etc.

TempSave B58 P610 D4

  • For low temperature soldering
  • Silver-free / Low voiding

Reduces soldering power consumption by up to 30% thanks to low temperature mounting

With a melting point of 139°C, this low-melting-point, lead-free solder can be used for mounting at temperatures lower than 180°C. Thanks to low temperature mounting, the solder reduces the power consumption of soldering equipment by up to 30%.
 
- Low voiding
- Energy saving (reduces power consumption during soldering by 20 to 30%)
- Halogen free

Highly rated for mounting on LED backlight boards

Highly rated for mounting on LED backlight boards

Recommended for soldering on thin boards that are sensitive to thermal loads. It has a high rating and has been adopted by Japanese household appliance manufacturers. It contains less tin than regular solders and also does not contain precious metals such as silver and copper, making it the perfect product for lowering material costs.
Request for product catalog/SDS