SN97C
Solder Paste for Dispensing Grade
- Melting Point
- 218-219℃
- Alloy
- Sn-Ag-Cu
Products
| Product Number | SN97C P603 D4 |
|---|---|
| Variation | (D4) |
| Application | General-purposeFor micro soldering |
| Type and Feature | Silver-containingCompletely halogen-free |
| Alloy | Sn-3.0Ag-0.5Cu |
| Melting Point | 218-219℃ |
| Flux | P603 |
| Flux Category | ROL0 |
| Presence of Halogen Elements | Completely halogen-free |
| Particle Size | D4 (Type 4)：20-38µm |
SN97C P603 D4
- General-purpose / For micro soldering
- Silver-containing / Completely halogen-free
Greater continuous dispensing capability due to enhanced activation
Completely halogen-free, dispenser-type solder paste with improved continuous dispensing capability and solder meltability due to enhanced activation.
- Good continuous dispensing capability
- Good meltability
- Completely halogen-free
Solder meltability (photos taken after dispensing and after reflow)
Solder meltability (photos taken after dispensing and after reflow)
Photo (Left) : after dispensing (R1608)
Photo (Right) : after reflow
Dispensing volume is stable, and its superior meltability ensures reliable bonding.