SN97C
Solder Paste for Dispensing Grade
- Melting Point
- 218-219℃
- Alloy
- Sn-Ag-Cu
Products
| Product Number | SN97C P603 D4 | SN97C P613 D5(D6)(D7) |
|---|---|---|
| Variations | (D4) | (D6) |
| Application | General-purposeFor micro soldering | For Jet DispensingFor micro soldering |
| Type and Features | Silver-containingCompletely halogen-free | Silver-containingCompletely halogen-free |
| Alloy | Sn-3.0Ag-0.5Cu | Sn-3.0Ag-0.5Cu |
| Melting Point | 218-219℃ | 218-219℃ |
| Flux | P603 | P613 |
| Flux Category | ROL0 | ROL0 |
| Presence of Halogen Elements | Completely halogen-free | Completely halogen-free |
| Particle Size | D4 (Type 4)：20-38µm | D5 (Type 5)：10-25µm / D6 (Type 6)：5-15µm / D7 (Type 7)：2-11µm |
SN97C P613 D5(D6)(D7)
- For Jet Dispensing
- Silver-containing / Completely halogen-free
P613 Series Designed for High-Speed, Non-Contact Jet Dispensing
A solder paste formulated specifically for high-speed jet dispensing applications.
Available in three powder size options (Type 5 / 6 / 7).
It maintains excellent shape retention even at high dispensing speeds, ensuring stable solder joints with precise and consistent volumes.
・High-speed dispensing: 30–7 shots/sec
・Supports ultra-fine dots: φ250–300 µm
・Completely halogen-free
Co-Developed with ESSEMTEC
Solder Print Appearance
Solder Print Appearance
Image：Dispensed dot diameter φ280 µmSolder Melting Characteristics
Solder Melting Characteristics
Left：Cu(OSP)
Center：Cu
Right：Ni
Exhibits excellent wettability and melting performance on various substrate materials, contributing to stable and consistent production quality.
SN97C P603 D4
- General-purpose / For micro soldering
- Silver-containing / Completely halogen-free
Greater continuous dispensing capability due to enhanced activation
Completely halogen-free, dispenser-type solder paste with improved continuous dispensing capability and solder meltability due to enhanced activation.
- Good continuous dispensing capability
- Good meltability
- Completely halogen-free
Solder meltability (photos taken after dispensing and after reflow)
Solder meltability (photos taken after dispensing and after reflow)
Photo (Left) : after dispensing (R1608)
Photo (Right) : after reflow
Dispensing volume is stable, and its superior meltability ensures reliable bonding.