SN100C
Solder Ball
- Melting Point
- 227℃
- Alloy
- Sn-Cu-Ni
Products
| Product Number | SN100C |
|---|---|
| Application | For BGA, CSP, MCM |
| Type and Features | Silver-freeGood impact resistance |
| Alloy | Sn-0.7Cu-0.05Ni-Ge |
| Melting Point | 227℃ |
| Particle Size | 0.08-0.25mm / 0.3-0.45mm / 0.5-0.76mm |
SN100C Solder Ball
- For BGA, CSP, MCM
- Silver-free / Good impact resistance
Highly reliable solder ball with excellent impact resistance
Highly reliable solder ball with excellent impact resistance that is made from SN100C alloy. It absorbs a large amount of energy relative to the impact speed, which gives it excellent impact resistance. It is ideal for ball grid array (BGA), chip size package (CSP), and multi chip module (MCM) soldering, among other applications.
Solder surface
Solder surface
The solder surface has a smooth finish. We provide high quality products with a precise granular shape and small tolerance.Compatible with fluxless mounting (laser soldering)
