SN97C
Solder Ball
- Melting Point
- 218-219℃
- Alloy
- Sn-Ag-Cu
Products
| Product Number | SN97C |
|---|---|
| Application | For BGA, CSP, MCM |
| Type and Feature | Silver-containingGood impact resistance |
| Alloy | Sn-3.0Ag-0.5Cu |
| Melting Point | 218-219℃ |
| Particle Size | 0.08-0.25mm / 0.3-0.45mm / 0.5-0.76mm |
SN97C ボールはんだ
- For BGA, CSP, MCM
- Silver-containing / Good impact resistance
Silver-containing, high-reliability solder ball
Solder ball containing SAC alloy (Sn-3.0Ag-0.5Cu). Please use flux (RM-5) when mounting.