High-reliability, lead-free solder preform containing SN100C alloy. Compatible with fluxless mounting performed by using formic acid reduction. As there is no need to wash off the flux residue after mounting, it is suitable for soldering semiconductor parts, for example.

Use example : IGBT module

SN100C alloy's high flexibility makes it possible to respond to expansion/contraction of the metal base caused by heat, thereby maintaining joint reliability.

Comes in diverse forms, including strips, ribbons, and washers

We can process the solder preform to the form, thickness, etc., of your choice. Please contact us for more details.