Product Information

NozzleSave S

Solder Bar
Melting Point
218-219℃
Alloy
Sn-Ag-Cu

Products

Product Number NozzleSave S
Application For selective solderingNozzle erosion prevention
Type and Feature Silver-containing
Alloy Sn-3.0Ag-0.5Cu-0.05Ni (+ other)
Melting Point 218-219℃

NozzleSave S

Reduced nozzle erosion

During the selective soldering process, nozzle erosion causes phenomena such as a changes in jetting height and one-sided wetting flow of the solder, resulting in the deterioration of the soldering quality. NozzleSave S is a solder alloy that solves the quality and cost issues caused by nozzle erosion. ・Reduced nozzle erosion ・Nozzle expense savings ・More consistent soldering quality

Improve the product life of a nozzle up to more than 2 times

Improve the product life of a nozzle up to more than 2 times

Nozzle erosion during selective soldering can cause "Jet height variation" and "One-sided solder wetting," which in turn deteriorates soldering quality.