SN100CV
Solder Ball
- Melting Point
- 221-225℃
- Alloy
- Sn-Cu-Ni
Products
| Product Number | SN100CV |
|---|---|
| Application | For BGA, CSP, MCM |
| Type and Feature | Silver-freeHigh strength |
| Alloy | Sn-0.7Cu-0.05Ni-Ge-Bi |
| Melting Point | 221-225℃ |
| Particle Size | 0.08-0.25mm / 0.3-0.45mm / 0.5-0.76mm |
SN100CV Solder Ball
- For BGA, CSP, MCM
- Silver-free / High strength
Silver-free, high-strength solder ball
SN100CV alloy-based, silver-free, high-strength solder ball. Contributes to material cost reduction and high durability.