SN96CI
Solder Ball
- Melting Point
- 217℃
- Alloy
- Sn-Ag-Cu
Products
| Product Number | SN96CI |
|---|---|
| Application | For BGA, CSP, MCM |
| Type and Feature | Silver-containingHigh strength |
| Alloy | Sn-3.8Ag-1.0Cu (+ other) |
| Melting Point | 217℃ |
| Particle Size | 0.08-0.25mm / 0.3-0.45mm / 0.5-0.76mm |
SN96CI Solder Ball
- For BGA, CSP, MCM
- Silver-containing / High strength
Silver-containing, high-reliability solder ball
Solder ball containing Sn-Ag-Cu alloy (Sn-3.8Ag-1.0Cu (+ other)). Please use flux (RM-5) when mounting.