Alconano Nano-Silver Paste

Alconano Nano-Silver Paste Products

These products are next-generation bonding materials in which nanometer-size (0.000001 mm) silver particles are covered with alcohol derivatives.
Thanks to its excellent conductivity, the product is garnering attention as a die bonding material for semiconductors and thermoelectric devices.

ANP-1 (General-purpose)

ANP-8 (Copper-containing)

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Application

Feature

Alloy

- products are match your selection
  • For component termination
  • High strength
  • General-purpose
  • For wave soldering
  • For selective soldering
  • For fine pitch soldering
  • For hot air solder leveling
  • Nozzle erosion prevention
  • Solder foil
  • Compatible with hot temperature soldering
  • For low temperature soldering
  • 自動はんだ付け機対応
  • Compatible with laser soldering
  • Tip wear prevention
  • For aluminum bonding
  • For joining heated wire glass (automobile)
  • Non-core type (bobbinless)
  • For (compatible with) formic acid reflow
  • For micro soldering
  • Crack and impact resistant
  • Washing unnecessary
  • For BGA, CSP, MCM
  • Silver-free
  • Silver-containing
  • Bridge prevention
  • Good workability
  • Reduced burning
  • Spattering prevention
  • Completely halogen-free
  • High strength
  • Improved impact resistance
  • Good impact resistance
  • Galvanic corrosion prevention
  • Silver leaching prevention
  • Waste reduction
  • 12-month shelf life
  • Low voiding
  • Low residue
  • Good continuous dispensing capability
  • Diverse forms
  • SN100C
  • SN100CV
  • SN97C
  • LF-C2
  • LF-Z3
  • ALUSAC-35
  • TipSave N
  • TempSave

Search by alloy

Select alloy system

Narrow down your search by selecting criteria

Multiple selections allowed

Add condition
Narrow down your search by selecting criteria

Please select your criteria and press the "Decide" button.

Application

Feature

Alloy

- products are match your selection
  • For component termination
  • High strength
  • General-purpose
  • For wave soldering
  • For selective soldering
  • For fine pitch soldering
  • For hot air solder leveling
  • Nozzle erosion prevention
  • Solder foil
  • Compatible with hot temperature soldering
  • For low temperature soldering
  • 自動はんだ付け機対応
  • Compatible with laser soldering
  • Tip wear prevention
  • For aluminum bonding
  • For joining heated wire glass (automobile)
  • Non-core type (bobbinless)
  • For (compatible with) formic acid reflow
  • For micro soldering
  • Crack and impact resistant
  • Washing unnecessary
  • For BGA, CSP, MCM
  • Silver-free
  • Silver-containing
  • Bridge prevention
  • Good workability
  • Reduced burning
  • Spattering prevention
  • Completely halogen-free
  • High strength
  • Improved impact resistance
  • Good impact resistance
  • Galvanic corrosion prevention
  • Silver leaching prevention
  • Waste reduction
  • 12-month shelf life
  • Low voiding
  • Low residue
  • Good continuous dispensing capability
  • Diverse forms
  • SN100C
  • SN100CV
  • SN97C
  • LF-C2
  • LF-Z3
  • ALUSAC-35
  • TipSave N
  • TempSave

Other Categories

Lead-Free Solder

Lead-Free Solder

We strive to develop environmentally friendly lead-free solder and other related materials, as well as providing reliable products. We also offer support for solder selection, improvement of mounting temperature and mounting process, and other operations.

Solder (Lead-Containing)

Solder (Lead-Containing)

The need for high-quality soldering materials and equipment is rapidly growing to enable the production of smaller, lighter, and thinner electronic devices. We provide a wide range of reliable products to satisfy diverse customer needs.

Soldering Flux

Soldering Flux

Flux products play a vital part in ensuring the finish and quality of metal bonding. We provide an array of products that improve bonding quality with features such as oxide film removal and enhanced wetting.

Alconano Nano-Silver Paste

Alconano Nano-Silver Paste

These products are next-generation bonding materials in which nanometer-size (0.000001 mm) silver particles are covered with alcohol derivatives. Thanks to its excellent conductivity, the product is garnering attention as a die bonding material for semiconductors and thermoelectric devices.